LASER STACK
Consultation Purchase goods LASER STACK 800–1200W — high-power diode laser device for hair removal for all skin and hair types Technology The device uses diode laser technology that emits light that penetrates through the skin to the root of the hair follicle, where it is absorbed by melanin. This causes heating and destruction of the follicle without damaging surrounding tissues. Three wavelengths ensure maximum efficiency: • 755 nm — superficial hair follicles, thin and light hair • 808 nm — classic wavelength for deep penetration, universal for all skin types • 1064 nm — for dark skin, deep location of hair bulbs Cooling is provided by a contact sapphire tip, TEC, water cooling and ventilation, maintaining a temperature of up to –25°C. Main characteristics Parameter Value Laser type Diode Wavelengths 755 nm + 808 nm + 1064 nm Laser power 800–2000 W Total device power 2400/2800/3200 W (depending on configuration) Frequency 1–10 Hz Pulse duration 10–300 ms Energy density Up to 100 J/cm² Spot size 15×30 mm / 10×12 mm / φ8 mm Display Touchscreen 12 inches (main) + 2.4 inches on the applicator Cooling system Water + air + TEC + sapphire, with acrylic tank Tip operating temperature Up to –25°C Power supply 90–130 V, 50/60 Hz or 200–260 V, 50 Hz Applicators With magnetic 3D tip and real monitoring system Service OEM / ODM, free software and case design Warranty Not specified Certification Not specified Main settings Selection of wavelength or combination (755/808/1064 nm) Adjustment of energy (up to 100 J/cm²) and pulse frequency Automatic calibration of applicator parameters (energy, pulse width, temperature) Control interface: main 12-inch display + mini-screen on the applicator Self-diagnosis system and notification of filter replacement Functions Professional laser hair removal for all skin phototypes Treatment of all body areas: face, armpits, bikini area, legs, arms Removal of light, thin, coarse hair Painless procedure due to deep cooling of the tip Reduction of ingrown hairs and irritation after shaving High processing speed of large areas (15×30 mm) Real-time monitoring of temperature and laser stability









